Azenta. has filed a patent for a substrate processing apparatus with a SCARA arm that allows for efficient rotation and extension/retraction movements. The design ensures the end effector can pass through a slot valve, enhancing overall functionality and versatility in substrate processing operations. GlobalData’s report on Azenta gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on Azenta, Semiconductor fabrication robots was a key innovation area identified from patents. Azenta's grant share as of January 2024 was 58%. Grant share is based on the ratio of number of grants to total number of patents.

Substrate processing apparatus with scara arm for slot valve pass-through

Source: United States Patent and Trademark Office (USPTO). Credit: Azenta Inc

The patent application (Publication Number: US20240001535A1) describes a substrate processing apparatus with a SCARA arm pivotally mounted to a frame, allowing for rotation and articulation of the arm. The SCARA arm includes at least one end effector that can rotate relative to the forearm about a wrist joint axis. The end effector is coupled to a wrist joint pulley, which is connected to the drive section via segmented transmission band segments. This configuration enables the extension and retraction of the SCARA arm to rotate the end effector and wrist joint pulley as a unit, facilitating substrate processing. Additionally, the height of the end effector is designed to fit within a stack height profile of the wrist joint, allowing it to pass through a slot valve.

Furthermore, the substrate processing apparatus can include multiple SCARA arms with different end effectors, each defining a unique transfer plane. The drive section may also incorporate a Z axis drive for vertical movement based on the gap between the stack height profile and the pass-through of the slot valve. The segmented transmission band segments ensure a secure coupling between the wrist joint pulley and the end effector, enhancing the efficiency and precision of substrate processing. Overall, the method outlined in the patent application provides a detailed process for processing substrates using the described apparatus, emphasizing the importance of the unique design features for seamless operation and effective substrate handling.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies