Azenta has been granted a patent for a semiconductor wafer mapping apparatus. The device includes a frame, movable arm, and an image acquisition system with an array of cameras for precise wafer detection. The apparatus aims to streamline semiconductor manufacturing processes with efficient wafer mapping capabilities. GlobalData’s report on Azenta gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Azenta, Semiconductor fabrication robots was a key innovation area identified from patents. Azenta's grant share as of May 2024 was 50%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor wafer mapping apparatus with edge detection
A semiconductor wafer mapping apparatus has been granted a patent (Publication Number: US12002696B2) that includes a frame with a wafer load opening, a movable arm with an end effector for loading wafers from a substrate carrier, and an image acquisition system with an array of cameras fixed on a common support. Each camera is positioned to view different parts of the substrate carrier through the wafer load opening, capturing images of each wafer held in the carrier. An illumination source connected to the common support illuminates the outer edge of each wafer, allowing for edge detection through image contrast. The apparatus is designed to efficiently map multiple wafers held in the substrate carrier by utilizing the array of cameras and edge detection technology.
Furthermore, the semiconductor wafer mapping apparatus includes a controller to move the movable arm and position the common support, ensuring accurate imaging of each wafer in the substrate carrier. The illumination source is strategically placed to blank background reflection light and highlight the outer edge of each wafer for precise edge detection. The method involves providing a frame with a wafer load opening, moving the movable arm to position the cameras for imaging, and illuminating the outer edge of each wafer. By capturing images of each wafer in the substrate carrier and utilizing edge detection technology, the apparatus can effectively create a substrate map of the wafers based on the information gathered by the array of cameras.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies
